Advanced Packaging and TSV Application Reports

• Through Silicon Via (TSV) Metrology

MEMS Application Reports

• Critical Dimension, Etch Depth, and Film Thickness Measurement

R&D Application Reports

• Characterizing Graphene with Multi-Angle Reflectometry and Ellipsometry

Optoelectronics Application Reports

• Characterizing Oxide Films for Waveguide Applications
• FilmTek™ 4000 Repeatability
• Characterizing Film Properties versus Temperature

Semiconductor Application Reports

• Characterizing Phase Change Materials: GeSbTe (GST)
• Characterizing SiGe
• Measuring Silicon on Insulator (SOI) Films
• Characterizing Very Thin ONO Films
• Characterizing Advanced Low-k Materials
• Characterizing High-k Materials
• Characterizing Amorphous Silicon and Polysilicon
• Characterizing Silicon on Sapphire (SOS)
• Measuring Surface Roughness
• Characterizing Photomasks

Flat Panel Display Application Reports

• Measuring Color Coordinates: Colored Resists
• Characterizing OLED Display Materials
• Characterizing Birefringent Materials: PET

Photovoltaic Application Reports

• Characterizing Thin Film Solar Cells