Critical Dimension, Etch Depth, and Film Thickness Measurement

FilmTek™ 2000M TSV Metrology Advantages

  • Fully automated metrology platform for fast and reliable critical dimension, etch depth, and film thickness measurement over a wide range of TSV sizes and aspect ratios
  • CD precision (1σ) < 0.2%
  • Etch depth precision (1σ) < 0.005%
  • Film thickness range: 10nm – 350μm
  • Film thickness precision (1σ) < 0.005%
  • Measurement time of 1-2 seconds per point
  • Pattern recognition by Cognex
  • Lowest total cost of ownership

Measurement of Critical Dimension (CD), Etch Depth, and Residual Silicon Thickness for MEMS Structures

Critical-dimension

 

Film Thickness (µm)

Etch Depth (μm)

Critical Dimension

 

Case Study: Comparison of Thickness, Etch Depth, and CD by FilmTekTM 2000M TSV and SEM

 

SEM FilmTekTM 2000M TSV
Si Thickness (µm) Etch Depth (µm) CD (µm) Si Thickness (µm) Etch Depth (µm) CD (µm)
18.3 125 89 18.96 124.46 89.30
8.2 123 88 8.57 123.93 88.46
11.6 126 89 11.59 126.58 88.72
8.9 126 87 8.75 126.79 86.57
  • Excellent agreement between FilmTek™ 2000M TSV and SEM data

TSV Me5