SCI’s expanding technology portfolio is focused on meeting tomorrow’s most critical metrology needs. To meet these demands, SCI engineers multi-modal metrology solutions, encompassing multi-angle spectroscopic ellipsometry, reflectometry, transmission, and scatterometry. We are dedicated to building custom solutions to solve our customers’ most pressing challenges.
3D semiconductor packaging metrology with unmatched speed, accuracy, and precision. Multi-modal metrology system for high-throughput measurements of Cu-pillars, bumps, through silicon vias (TSVs), redistribution layer (RDL) and other packaging processes.
Advanced film analysis with the highest accuracy, precision, and versatility in the industry. Patented multi-angle DUV-NIR polarized reflectometry and spectroscopic ellipsometry technique engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production.