Characterizing Advanced Low-k Materials

FilmTek™ Advantages

  • Advanced process control achieved with FilmTek’s™ high resolution measurement of optical constants and thickness using SCI’s patented Differential Power Spectral Density (DPSD) technology.
  • Measure graded low-k films (e.g., after plasma damage) with SCI’s advanced modeling algorithms.
  • Superior film characterization enables accurate and repeatable CMP and trench depth process monitoring of multi-layer low-k film stacks on copper.

Low-k (As Deposited)

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Low-k (Plasma Damaged)