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FilmTek 4000EM-DUV
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FilmTek 3000
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FilmTek 1000
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Integrated Metrology

 

 

 

FilmTek™ 3000, FilmTek™ 3000M, and  FilmTek™ 3000 PAR

DUV Reflection and Transmission Spectrophotometry

 

FilmTek™ 3000 measures transmission and reflection of films deposited on transparent substrates. It is ideally suited for measuring the thickness and optical constants of very thin absorbing films deposited on transparent substrates.  FilmTek™ 3000 combines fiber-optic spectrophotometers with SCI's proprietary material modeling software to provide an affordable and reliable tool for the simultaneous measurement of film thickness, index of refraction, and extinction coefficient.  FilmTek™ 3000M has a small spot size (as small as 2 µm) and can be equipped with a large custom stage for flat panel display applications.  When equipped with the polarimetry option, FilmTek™ 3000P combines spectroscopic reflection, transmission, and polarimetry measurements for the accurate and simultaneous determination of optical constants and birefringence.  The FilmTek™ 3000 PAR utilizes SCI's patented parabolic mirror technology developed for the FilmTek™ 4000EM-DUV to achieve a 50µm measurement spot size and simultaneously measure wavelengths from the deep ultra-violet to the near infrared.  FilmTek™ 3000 provides unmatched accuracy, ease of use, and analytical power in a fully integrated package.

 


FilmTek™ 3000

 


FilmTek™ 3000M

 

 
FilmTek™ 3000M

Flat Panel Display

 
FilmTek™ 3000 PAR

 

 

FilmTek™ 3000 Features

Versatile: FilmTek™ 3000 incorporates SCI’s generalized material model with advanced global optimization algorithms for simultaneous determination of:


- Multiple layer thicknesses
- Indices of refraction [ n(l ) ]
- Extinction (absorption) coefficients [ k(l ) ]
- Energy band gap [ Eg ]        
- Constituent and void fraction
- Surface roughness

Low Cost: The cost of ownership of FilmTek™ 3000 is a small fraction of comparable instruments.
No Special Knowledge Required: FilmTek™ 3000 software is designed so that minimal experience in personal computers, thin film optical design, or measurement techniques is required.
Complete "turn key" System: A fully integrated spectrophotometer measurement system with calibration, acquisition, and analysis software.
Non-contact and non-destructive.
Flexible: FilmTek™ 3000 hardware and software can be easily modified to satisfy unique customer requirements.
Optional features:

 

- Computer controlled automated stage
- Large custom stages for flat panel display applications
- Small spot size (2 microns)
- Pattern recognition (Cognex)
- Polarimetry
- Cassette to cassette wafer handling

 

Applications

Virtually all translucent films ranging in thickness from less than 100 angstroms to approximately 150 microns can be measured with high precision. Typical applications include:


Flat panel display OLED
Semiconductor and dielectric materials Solar Cell
Multilayer optical coatings Coated glass
Optical antireflection coatings Laser mirrors
Electro-optical materials Thin metals


Example Films
SiOx a-Si   Alq3
SiNx a-C:H   HIL
DLC ITO   BEML
SOG         Polysilicon   GEML
Photoresist Polyimide   GETL
Thin Metals Color Dye   REML


Example Substrates
Silicon GaAs
SOI Glass
SOS Aluminum

 

 

 

FilmTek™ 3000 / 3000M / 3000 PAR Technical Specifications
Film thickness range:
3nm to 350µm (5nm to 150µm is standard)
Film thickness accuracy:
±1.5Ĺ for NIST traceable standard oxide 1000Ĺ to 1µm
Spectral range:
190nm to 1700nm (240nm to 1000nm is standard)
FilmTek™ 3000 measurement spot size:
2mm to 5mm (5mm standard)
FilmTek™ 3000M measurement spot size:

5µm to 50µm
FilmTek™ 3000 PAR measurement spot size:

25µm to 300µm (50µm standard)
Sample size:
2mm to 300mm standard
Spectral resolution:

0.3-2nm
Light source:
Regulated deuterium-halogen lamp (2,000 hrs lifetime)
Detector type:
2048 pixel Sony linear CCD array / 512 pixel cooled Hamamatsu InGaAs CCD array (NIR)
Computer: Multi-core processor with Windows™ 7 Operating System
Measurement time:

<2 sec (e.g., oxide film)
Data acquisition time:
0.5 sec

 

Film(s) Thickness Measured Parameters Precision (1σ)
Oxide / Si 200-500 Ĺ t 0.5 Ĺ
500-10,000 Ĺ t 0.25 Ĺ
1000 Ĺ t, n 0.25 Ĺ / 0.001
Nitride / Si 200-10,000 Ĺ t 0.25 Ĺ
Photoresist / Si 200-10,000 Ĺ t 0.5 Ĺ
a-Si / Oxide / Si 20-10,000 Ĺ t 0.5 Ĺ

 

 

 

Methodology

FilmTek™ simultaneously solves for refractive index n(l), extinction coefficient k(l), and thicknesses of multi-layer film structures.  A self-consistent solution is obtained by using SCI’s generalized dispersion formula to model fitted values of the dielectric function e (l).  The SCI dispersion formula is quite general and applies to metallic, amorphous, crystalline, and dielectric materials (Figures 1-3).  This approach allows the user to model complex multi-layer structures with reflection/transmission data.  Global optimization methods are used to obtain the best solution while avoiding local minima and minimizing sensitivity to the user’s initial guess of fitted parameters (e.g., layer thickness).  FilmTek™ optimizes both the reflectance and power density spectrum (FFT) simultaneously.  This unique feature allows for accurate thickness determination over a wide range of thickness (3nm to 350µm).

 

 

 
Fig. 1 n and k spectra of Silicon 		 
Fig. 2 n and k spectra of SiO2		  
Fig. 3 n and k spectra of Tantalum

Related Information

FilmTek™ 3000 Product Overview.pdf

 

 

 

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